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2mm Modular Board to Board Interconnection System Amphenol HM2P07PDG1A1N9LF Hard Metric Configuration

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2mm Modular Board to Board Interconnection System Amphenol HM2P07PDG1A1N9LF Hard Metric Configuration

Description : Hard Metric, Standard RoHS

Mfr. Part # : HM2P07PDG1A1N9LF

Model Number : HM2P07PDG1A1N9LF

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Product Overview

Millipacs is a 2mm modular, Board-to-Board Interconnection system in Hard Metric (HM) configuration, offering a cost-effective, flexible, and versatile solution. Its broad range of options and user flexibility make it suitable for various applications. Key features include Hard Metric compliance, 2mm pitch for optimized PCB design, modularity, and multiple contact lengths for diverse PCB thicknesses and hot-swapping capabilities. The system incorporates multipurpose centers, coding, and guiding features for easy and accurate mating. With SI performance up to 3Gb/s and the option for hybrid connectors (signal, power, coaxial), Millipacs enables versatile circuit designs. It conforms to IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards, making it ideal for chassis-based packaging in communications, data, medical, industrial, and instrumentation segments.

Product Attributes

Brand: Millipacs
Configuration: 2mm modular, Board-to-Board Interconnection system, Hard Metric (HM)
Insulator Material: Thermoplastic UL94 V-0 (standard press-fit), High temperature polymer (Pin-in-Paste terminations)
Contact Material: Copper Alloy
Contact Plating Material: Gold / Palladium Nickel (mating area), Tin over Nickel (press-fit/pinin-paste terminal area)
Standards Conformance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
Certifications: UL and CSA recognized
Packaging: Tray packaging (standard versions), Tape and Reel packaging (Pin-in-Paste versions)

Technical Specifications

Specification	Details
Pitch	2mm
SI Performance	Up to 3Gb/s
Operating Current	1.5A at 20C; 1.0A at 70C
Test Voltage	750Vrms
Contact Resistance	20m max.
Insulation Resistance	10⁴M min.
Mating Force	0.75N max. per contact pair
Withdrawal Force	0.15N min. per contact pair
Hertz Stress	200Kpsi min.
Misalignment	Longitudinal 2.0mm; Transversal 2.5mm
Operating Temperature Range	-55C to +125C
Target Markets	Communications, Data, Medical, Industrial, Instrumentation, IP, LAN/WAN, Servers, Storage, Test & Measurements, Process/Factory Automation, Railway, Avionics, Video Surveillance, MRI Scanners
Part Number Examples (Vertical Header)	HM2P07P (22 col, 50mm, Press-fit), HM2P08P (25 col, 50mm, Press-fit), HM2P09P (11 col, 25mm, Press-fit), HM2P11P (55 signal + 3 power/coax, 50mm, Press-fit), HM2P40P (22 col, 50mm, Press-fit), HM2P09S (11 col, 25mm, Pin-in-Paste), HM2P11S (55 signal + 3 power/coax, 50mm, Pin-in-Paste)
Performance Levels (Mating Cycles)	3 (50 cycles), 2 (250 cycles), 1 (500 cycles)

2411261521_Amphenol-HM2P07PDG1A1N9LF_C3653538.pdf

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