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Surfacemount Chip Carrier Socket 3M 8444-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Designs

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Surfacemount Chip Carrier Socket 3M 8444-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Designs

Number of Positions : 44P

Adaptation Package Type : PLCC

Description : 44P PLCC IC Sockets RoHS

Mfr. Part # : 8444-21A1-RK-TP

Model Number : 8444-21A1-RK-TP

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Product Overview

The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular applications. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open-top design allows for unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.

Product Attributes

Brand: 3M
Product Line: 3M Chip Carrier Sockets
Series: 8400 Series
Mounting Type: Surfacemount
Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact Material: Copper Alloy
Underplating: 50 " [ 1.27 m ] Nickel
Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
Certifications: RoHS Compliant (RIA E1 and C1 apply)
Packaging Options: Tube Pack (TP), Tape and Reel (TR)

Technical Specifications

Specification	Value
Accepts Chip Carriers	JEDEC outline MO-047 (square) and MO-052 (rectangular)
Insulation Resistance	>10³ M minimum
Capacitance	<1 pF at 1 MHz
Temperature Rating	-40C to +105C
Process Rating	Maximum 260C, single pass (profile per J-STD-020C)
Moisture Sensitivity Level	1 (per J-STD-020C)
Contact Resistance	15 m

Ordering Information

Note on Tin Plating: 3M PLCC products are tin plated on the contact wiping surface. This is necessary for mated reliability. Tin whiskers are an inherent characteristic of tin, and mechanical stress can drive whisker growth. It is possible for PLCC and PLCC sockets to exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations with whisker-mitigating tin plating chemistry to reduce the likelihood of growth. Evaluate suitability based on product application lifespan, environment, mechanical stresses, humidity, and thermal cycling.

Contact Quantity and Dimensions (mm [Inch]):

Contact Quantity	A	B	C	D	E	F	G	H
20	15.65 [0.616]	15.65 [0.616]	5.08 [0.200]	5.08 [0.200]	10.03 [0.395]	10.03 [0.395]	12.70 [0.500]	6.35 [0.250]
28	18.18 [0.716]	18.18 [0.716]	7.62 [0.300]	7.62 [0.300]	12.57 [0.495]	12.57 [0.495]	15.24 [0.600]	7.62 [0.300]
32	18.18 [0.716]	20.75 [0.817]	7.62 [0.300]	10.16 [0.400]	12.57 [0.495]	15.11 [0.595]	17.78 [0.700]	7.62 [0.300]
44	23.28 [0.917]	23.28 [0.917]	12.70 [0.500]	12.70 [0.500]	17.65 [0.695]	17.65 [0.695]	20.32 [0.800]	10.16 [0.400]
52	25.84 [1.017]	25.84 [1.017]	15.24 [0.600]	15.24 [0.600]	20.19 [0.795]	20.19 [0.795]	22.86 [0.900]	11.43 [0.450]
68	30.95 [1.219]	30.95 [1.219]	20.32 [0.800]	20.32 [0.800]	25.27 [0.995]	25.27 [0.995]	27.94 [1.100]	13.97 [0.550]
84	36.00 [1.417]	36.00 [1.417]	25.40 [1.000]	25.40 [1.000]	30.35 [1.195]	30.35 [1.195]	33.02 [1.300]	16.51 [0.650]

Alignment Feature:

A = With Location Post (tube packaging only)
B = Without Location Post

Packaging:

TP = Tube Pack
TR = Tape and Reel (Contact 3M for dimensions)

Tolerance: Unless Noted: .3 mm, .20 [ ] Dimensions for Reference Only

2410121845_3M-8444-21A1-RK-TP_C3170600.pdf

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