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Y-Width of Bottom Edge on Board : -
Reference Series : HY
Pins Structure : 1x4P
Contact Plating : 锡
Contact Material : 黄铜;PA66
Operating Temperature : -25℃~+85℃
Flame Retardant Rating : UL94V-0
Supplementary Features : -
Pitch : 2mm
Voltage Rating (Max) : 250V
Number of PINs Per Row : 4
Number of Rows : 1
X-Length of Bottom Edge on Board (Spacing Line) : -
Z-Height of the Board : -
Row Spacing : -
Mounting Type : 卧贴
Description : Connector Header 4 position 2mm Pitch Surface Mount, Right Angle
Mfr. Part # : HY-4P
Package : SMD,P=2mm,Surface Mount,Right Angle
Model Number : HY-4P
The HY series connector strip is designed for reliable electrical connections, featuring robust materials and adherence to international testing standards. It is suitable for applications requiring stable performance across a wide temperature range and supports various wire sizes and PCB thicknesses. Key applications include general electrical equipment and electronic devices where dependable connectivity is essential.
| Section | Item | Description/Specification | Requirement/Value | ||
|---|---|---|---|---|---|
| 1. SCOPE | Applicable Product | HY series connector strip | Product performance, test methods and inspection requirements | ||
| Applicable Standards | GB/T2421 | Electrical Connectors Environmental Testing - Part 1: General Principles | |||
| GB/T2423 | Electrical Connectors Environmental Testing Methods | ||||
| GB/T2424 | Electrical Connectors Environmental Testing Guidelines | ||||
| 3. USE CONDITION | Ambient Temperature Range | -25+85 | |||
| Applicable Wire Sizes | AWG#24#30 | ||||
| Applicable PC Board Thickness | 0.8~1.6mm | ||||
| 4. Appearance and Dimension | Appearance | Product surface without defect, dirt, crack, and mechanical damage; Contact without rust, plating not oxidized and not peeled. | |||
| Dimension | According to drawings | ||||
| Exchangeability | Same specification products should be exchangeable. | ||||
| 5. Material | Part Name | Type | Material | Finish | Explanation |
| Terminal | Contact | Phosphor bronze (0.20mm thick) | Tin Plating: 3~5m | ||
| Housing | Plastic | Nylon66 UL94V-0, Color: White | |||
| Wafer | Contact | Brass (0.50mm thick) | Tin Plating: 2.5~5m | ||
| Housing | Plastic | Nylon66 UL94V-0, Color: White | |||
| Wafer | Contact | Brass (0.50mm thick) | Tin Plating: 2.5~5m | ||
| Housing | Plastic | LCP UL94V-0, Color: Beige | |||
| Wafer | Solder tab | Brass (0.40mm thick) | Tin Plating: 3~5m | ||
| Housing | Plastic | LCP UL94V-0, Color: Beige | |||
| 6. Electrical Performance | Rated Current | 2A (AC/DC) | |||
| Rated Voltage | 250V (AC/DC) | ||||
| Contact Resistance | Test Mode: Mate connector, 20mV max voltage, 100mA max current | Initial value: 20m (Excludes wire resistance) | |||
| Withstand Voltage | Test Mode: 1000V AC (rms) for 1 minute between adjacent terminals and ground | No breakdown or flashover; Leakage current 0.5mA | |||
| Insulation Resistance | Test Mode: 500V DC (rms) for 1 minute between adjacent contacts | 1000 M | |||
| 7. Mechanical Performance | Terminal crimping wire strength | Test Mode: Axial pullout force at 25 3mm/min rate | AWG#24: 30N AWG#26: 20N AWG#28: 13N AWG#30: 8N | ||
| Fixed terminals and hole seat | Test Mode: Pullout force along wire direction at 25 3mm/min rate | Per contact: 15N | |||
| Single contact insertion force | Test Mode: Insertion force at 25 3mm/min rate | 6N | |||
| Single contact withdrawal force | Test Mode: Pullout force at 25 3mm/min rate | 0.5N | |||
| Pin Retention force | Test Mode: Pullout force at 25 3mm/min rate on pin end | Per contact: 15N | |||
| 8. Endurance Characteristics | Durability | Test Mode: 30 cycles (max 10 cycles/min) before environmental test | Contact Resistance: 30m | ||
| Vibration | Test Mode: Connector on PCB, 10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis (X, Y, Z) | Appearance: No damage Contact Resistance: 30m Current Discontinuity: 1sec Max | |||
| 9. Environmental Performance | Thermal Aging | Test Mode: 852 for 96 hours | Appearance: No damage Contact Resistance: 30m | ||
| Temperature Rise | Test Mode: Measure contact temperature rise at max rated current | 30 Max | |||
| Humidity | Test Mode: 402, 90-95% RH for 96 hours | Appearance: No damage Contact Resistance: 30m Insulation Resistance: 500M Withstand Voltage: No breakdown or flashover | |||
| Temperature Cycling | Test Mode: 5 cycles (-553 for 30min, 853 for 30min, with transition time) | Same as Humidity test | |||
| Salt Spray | Test Mode: 353, 51% solution; 8 hours (plated after stamping) or 48 hours (stamping before plating) | Appearance: No damage Contact Resistance: 30m | |||
| Solderability | Test Mode: Immersion in solder at 2455 for 30.5S | Area of Soldering: 90% | |||
| Resistance to soldering heat | Test Mode: Manual soldering (3055, 30.5S) or Wave soldering (2305, 50.5S) or Reflow soldering (2555, 20S Max) | Appearance: No damage | |||
| 10. Caution | Plastic parts are hygroscopic. Avoid exposure to temperatures >30 and humidity >60% RH after opening packaging. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering. | ||||
| 11. Packaging, Transportation, Storage | Packaging | Terminal: Disc loading material packaging. Housing: Plastic bags. Wafer: Tray or bag packaging. Includes certificate with product name, specifications, quantity, production date. Exterior: Carton with packing list. Product must not move within the box. | |||
| Transportation | Any vehicle. Must be moisture-proof and protected from mechanical damage. Transport temperature: -20~+50. | ||||
| Storage | Ambient temperature: -10 to +40, Relative humidity 80%. Store in a warehouse free of acidic, alkaline, or corrosive gases. Storage duration: 6 months. Re-qualification test required after 6 months. | ||||
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