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solderless interconnect CINCH 3180299353 proven under extreme mechanical shock and vibration conditions

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solderless interconnect CINCH 3180299353 proven under extreme mechanical shock and vibration conditions

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Description : Rectangular Connector Accessories

Mfr. Part # : 3180299353

Model Number : 3180299353

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Product Overview

CIN::APSE is a solderless, high-density, custom interconnect technology designed for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. It is the industry's most widely implemented crimpless and solderless interconnect for high-speed applications, capable of supporting signals well above 50 Gbps. The unique 2-piece, patent-protected design utilizes randomly wound gold-plated molybdenum wire contacts that achieve termination through compression, ensuring multiple points of contact per I/O. CIN::APSE offers a wide range of profiles from 0.020 (0.5mm) to 1.0 (25mm) and is available in contact diameters of 0.020 (0.5mm) and 0.039 (1.0mm) with standard pitches of 0.039 (1.0mm) or greater. The technology is proven reliable under extreme mechanical shock and vibration, features quick, solderless installation, and provides low contact resistance with minimal Z-axis compression force. Key applications span satellite & space, military & aerospace, radar & surveillance, telecommunications, transportation, and computer industries.

Product Attributes

  • Brand: CIN::APSE
  • Technology: Solderless Compression Interconnect
  • Contact Material: Molybdenum with 20 - 30in. gold plating
  • Insulator Housing Materials: Liquid Crystal Polymer / Polyetherimide / Composites / Ceramics
  • Packaging Material: Anti-static ABS (example)
  • Certifications: RoHS and REACH compliant
  • Installation: Solderless
  • Design: 2-piece, patent protected

Technical Specifications

Specification Details
Contact Diameter 0.020 (0.5mm) and 0.039 (1.0mm)
Standard Pitch 0.039 (1.0mm) or greater
Signal Speed Capability 50+ Gbps
Profile Range 0.020 (0.5mm) to 1.0 (25mm)
Maximum I/O Count (Implemented) 7,396 I/Os
Contact Resistance <15 m (at approx. 2 oz. / 0.55 N compression force)
Current-Carrying Capacity ( 0.5mm contact) 6.5 Amp (maximum current, 30C temperature rise)
Inductance <0.75 nH (Up to 3.05 GHz)
Insulation Resistance (@ 100 VDC) > 50,000 M
Dielectric Withstanding Voltage 250 VDC
Vibration Resistance 5.4 Gs; 10 - 500Hz; no discontinuity greater than 2 nanoseconds
Shock Resistance 50 Gs; 11 milliseconds; no discontinuity greater than 2 nanoseconds
Temperature Life 1,000 hours @ 105C (<5% resistance change)
Thermal Shock 100 cycles -30C to +100C (<5% resistance change)
Humidity 1,000 hours @ 25C to 65C, 85% relative humidity (<20% resistance change)
Outgassing (ASTM E595) 1.0% Total Mass Loss (TML), 0.1% CVCM
Mechanical Durability (Stacking Connectors) > 100 mating cycles
Housing Material (Stacking Connectors) UL94V-O rated liquid crystal polymer
Plunger Material (Stacking Connectors) Gold-plated copper alloy
Operating Temperature (Stacking Connectors) -55 to 125C
Stacking Connector Heights 0.125 (3.18mm), 0.250 (6.35mm), 0.277 (7.04mm)
Stacking Connector Positions 25, 51, 83, 166, 249
Stacking Connector Rows 2, 5
Stacking Jumper Thickness 0.008 (0.203mm)
Stacking Jumper Length 3.0 (76.2mm)
Stacking Jumper Width (25 pos) 1.10 (27.94mm)
Stacking Jumper Width (51 pos) 1.75 (44.45mm)
ECC Wire Gauge Termination 24 to 30 AWG Stranded Wire
ECC Solder Cup Termination 26 to 30 AWG

2311150423_CINCH-3180299353_C17425919.pdf


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